Super-nano domains enable strength-conductivity synergy in copper foils
Summary
The development of copper foils that simultaneously exhibit ultrahigh strength, high electrical conductivity, and thermal stability remains a major challenge for advanced electronics and energy storage systems. We report a 10-micrometer-thick copper foil featuring nanoscale grains and periodically distributed gradient super-nano domains (approximately 3 nanometers in size) throughout its thickness that was produced by an industrially scalable electrodeposition process. This copper foil dem
Content
# Super-nano domains enable strength-conductivity synergy in copper foils
*Published: 2026 Apr 16*
The development of copper foils that simultaneously exhibit ultrahigh strength,
high electrical conductivity, and thermal stability remains a major challenge
for advanced electronics and energy storage systems. We report a
10-micrometer-thick copper foil featuring nanoscale grains and periodically
distributed gradient super-nano domains (approximately 3 nanometers in size)
throughout its thickness that was produced by an industrially scalable
electrodeposition process. This copper foil demonstrates a combination of
approximately 900-megapascal tensile strength, 90% standard electrical
conductivity, and exceptional thermal stability. These superior properties
originate from a dual strengthening-stabilization mechanism in which the
periodically distributed super-nano domains both enhance strength and stabilize
grain boundaries. This strategy not only advances copper foil technology but
also provides a general design pathway for developing other scalable,
high-performance metallic materials.
DOI: 10.1126/science.aed7758